Varför har pulverlackering dessa fördelar

Electrostatic powder coating, as the name suggests, is to make the MDF conductive, and then charge the sprayed solid particle powder through the electrostatic spray gun. No more adsorption, so the powder can be self-leveling on the surface of the board without accumulating in one place, and then the powder on the surface of the board is melted by medium wave infrared rays, and a fully enclosed coating can be formed on the surface of the board after cooling. . This is the sheet electrostatic powder coating process. Since the domestic electrostatic powder coating process for sheet metal is still in the exploratory stage, of course, there are inevitably many process problems. I have been engaged in electrostatic powder coating for four years, basically feeling the stones to cross the river, and have suffered enough, because There is no experience to learn from, and even the almighty Du Niang could not find any relevant introduction. After several years of exploration, I gradually found out a little experience. First of all, regarding the electrical conductivity of the board, as we all know, hardware is good for electrical conductivity, but the board is basically non-conductive. Even if the humidity is sufficient, due to the uneven density of the MDF, the electrical conductivity will not be good, and the resulting powder will be uneven. Or the powder rate is very low, so the first thing to solve is the electrical conductivity of the sheet. A simpler way is to keep the moisture content of the board not too low, and the moisture content is too low to conduct electricity, but it can not be too high, between 7-9 percent is the best; then keep the humidity of the dusting room environment above 40 percent . The more complicated method is to make a fuss on the surface of the plate. Secondly, to solve the problem of cracking and shrinkage of the edge of the plate after the high temperature furnace, this problem should be a problem that cannot be completely solved at present. The current common method is to use low temperature powder to minimize the cracking phenomenon. In addition, it is also necessary to pay attention to the density and moisture content of the board. The density of the board must be as uniform as possible. The visual inspection method is to see whether the fibers in the cross-section are uniform after sawing the board, and then the moisture content must be controlled within No more than 10 percent . If you recall Newton's experiment, you will know how strong the water vapor is. It takes minutes to prop up a MDF. Third, there are problems such as delamination, foaming, pinholes, orange peel, etc. Compared with the above two problems, this problem is a problem of process techniques. The key to solving these problems lies in the treatment of the substrate. The surface of the wood must be clean and free of oil, which will cause non-stick and delamination; here is the key to mention, because the processing process will inevitably cause damage to the board, and the common practice of workers is to use 502 glue to mix wood bran to make up. It can be used for paint, but not for dusting. Even if the layer is not delaminated, there will be marks. It is best to use putty or PUR glue to patch the board. As for the blistering pinhole phenomenon, the solution is to do a back cover treatment on the substrate.